On Monday, Taiwanese mobile chipmaker MediaTek announced the Dimensity 1050 system-on-chip (SoC) as the latest model in its Dimensity portfolio. The new chip is the company’s first offering to support millimeter wave (mmWave) 5G connectivity and the widely accepted sub-6GHz frequency. Adding mmWave 5G to the Dimensity 1050 SoC has allowed MediaTek to toughen up competition for Qualcomm, which has all of its Snapdragon platforms supporting the same mobile network technology. MediaTek also released the Dimensity 930 and Helio G99 as two other chips for next-generation smartphones.
Based on the TSMC 6nm process technology, the MediaTek Dimensity 1050 SoC has an octa-core CPU. The chip supports 3CC carrier aggregation on the sub-6GHz (FR1) spectrum and 4CC carrier aggregation on the mmWave (FR2) spectrum. The company claims that the Dimensity 1050 can deliver up to 53 percent faster speeds and extended range to smartphones through its LTE + mmWave aggregation.
MediaTek Dimensity 1050 would deliver up to 53 percent faster connectivity. Photo Credit: MediaTek
The presence of mmWave 5G support on the Dimensity 1050 allows for better connectivity in smaller, densely populated areas.
MediaTek has integrated two ARM Cortex-A78 CPUs with speeds up to 2.5 GHz and the ARM Mali-G610 graphics processing unit with the new Dimensity SoC. There’s also support for Wi-Fi optimizations and Wi-Fi 6E support, a 2×2 MIMO antenna, and MediaTek’s HyperEngine 5.0 gaming technology to support lower latency connections with the new triband – 2.4GHz, 5GHz, and 6 GHz frequency. The chip also includes support for UFS 3.1 storage and LPDDR5 memory.
The Dimensity 1050 SoC supports 144Hz full-HD+ displays and MediaTek’s Miravision 760 video enhancement technology. The chip can deliver simultaneous streams through the front and rear cameras of the device using a dual HDR video capture engine. Furthermore, MediaTek’s APU 550 supports artificial intelligence (AI) based camera actions. The company also claims that there is improved noise reduction for low-light shooting.
In addition to the Dimensity 1050 SoC, MediaTek unveiled the Dimensity 930 as its new 5G chip to support mixed duplex FDD+TDD for fast connectivity. The chip also offers support for 120Hz full-HD+ displays, MiraVision HDR video playback, and HDR10+ video. In addition, HyperEngine 3.0 Lite gaming improvements are touted to allow for lower latency and longer battery life.
The company also introduced the MediaTek Helio G99 as an upgrade to the Helio G96. The new 4G chip delivers more than 30 percent energy savings for gaming over the previous Helio model.
Regarding availability, smartphones based on the Dimensity 1050 and Helio G99 will be available in the third quarter, while the Dimensity 930 will debut in the global market in the second quarter, MediaTek said.
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